300-2HD Dual target magnetron sputtering coater

Presenting the 300-2HD dual-target magnetron sputtering coater, a high-vacuum coating equipment developed independently by our company. This versatile coater is engineered for the preparation of a wide array of material films, including monolayer or multi-layer ferroelectric, conductive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, polytetrafluoroethylene films, and more. In comparison to similar equipment, it stands out for its compact size, user-friendly operation, and the ability to accommodate a diverse range of materials, making it an ideal laboratory tool for various material film preparations.
 

Specifically designed for optimal performance, the 300-2HD coater requires installation under specific conditions: altitudes of 1000m or lower, temperatures within the range of 25℃±15℃, and humidity levels of 55% Rh ± 10% Rh. Essential requirements include a self-circulating chiller for water, AC220V 50Hz electricity with a reliable ground connection, and 99.99% or higher purity argon gas for chamber filling. A sturdy workbench capable of bearing over 200kg and a ventilation device are also necessary components for its operation.
 

Key features of this coater include two target guns, with an RF power supply for sputter coating non-conductive targets and a DC power supply for sputter coating conductive materials. This dual functionality enables the preparation of various films, expanding its applications. Despite its versatility, the coater maintains a compact size and ease of operation. Operating on a power supply voltage of 220V 50Hz with a rated power of 1200W (excluding the vacuum pump), it maintains a working vacuum degree of 10⁻⁴Pa and a working temperature range from room temperature to 500℃ with an accuracy of ±1℃.
 

The coater includes one target gun with water cooling, accepting target sizes of Ø2’’ with thicknesses ranging from 0.1mm to 5mm, depending on the target material. Optional power configurations include DC sputtering power of 500W and RF sputtering power of 300W or 500W. The loading sample table accommodates Ø140mm samples with adjustable rotation speeds within the range of 1rpm to 20rpm. For protective gas, inert gases such as Ar and N2 are used, controlled by a mass flow meter with 2 channels and a flow rate of 200SCCM. The specifications of the main unit measure 500mm × 560mm × 660mm, while the entire machine's size is 1300mm × 660mm × 1200mm, with a weight of 160kg. Standard accessories provided with the coater include a DC power control system, RF power control system, film thickness monitor system, molecular pump, chiller, cooling water pipes (Ø6mm), and various targets such as gold, indium, silver, and platinum.


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